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Silver dipping process of MLCC
2017-07-09 18:01  Visit:219
Price:Unfilled
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Model Number: GTG225 Key Specifications/Special Features: Silver dipping process of MLCCSplicing for release paperPlate masking on PCBFor powder coating process on PCBPet film: 25Total thickness: 50Adhesion(kg/25mm): over 0.6
  • Unwinding force (g/25mm): under 600
  • Temp: 180°C
    • Shipping Information:
    • FOB Port: Taiwan
    Main Export Markets:
    • Mid East/Africa
    • North America
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    TO: solarplus

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    Contact information
    Company:Solar Plus Company
    Status:Offline Send a letter
    Name:solarplus(Ms.)
    Tel: (886 3) 3272089 (886) 932921890
    Fax: (886 3) 3272067
    Area:Beijing
    Address:1F., no.480, Sec., 6, Yanping N.Rd.,Shihlin District, Taipei city,, Taipei, Taiwan (11175)
    Zip code:000000
    Mail:[email protected]
    Linkurl:http://solarplus.meilidijing.com/
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